| Time | Topic | Guest |
|---|---|---|
| 9:30-10:00 | Check-in and socializing | |
| 10:00-10:05 | Host's Opening Speech | |
| 10:05-10:10 | Leader's Speech | Yu Zongguang |
| 10:10-10:30 | Development of Integrated Chips Driven by Chiplet Technology | Yu Zongguang |
| 10:30-10:50 | EDA Enables Design and Simulation of Advanced Glass Substrate Packaging | Dr Xiaobo Huang |
| 10:50-11:20 | The age of AI and Advanced Packaging | Zhengtianye (Daniel) Wang |
| 11:20-11:40 | Challenge and Solutions of PLP Driven for Chiplet and Glass Core Technology | Lin Tingyu |
| 11:40-13:30 | Lunch Break | |
| 13:30-14:00 | Check-in and socializing | |
| 14:00-14:20 | Difficulties in the Production Processes of TGV Metal Lines and Their Technical Solutions | Wei Bingyi |
| 14:20-14:40 | FOPLP for optical application | Steve Jin |
| 14:40-15:00 | Advancement of Packaging Technology Empowered by Substrate Glass Materials | Jin Liangmao |
| 15:00-15:20 | Laser Induced Drilling, Cutting and Repair Solutions for Glass Substrates in Advanced Packaging | Ni Zikai |
| 15:20-15:40 | Innovative Solutions from Jingce Electronic Supporting Yield Management Across Full Semiconductor Processes | Hu Wei |
Join us on social media
© Messe Muenchen Shanghai Co., Ltd.
備展-01首頁(yè)-9.png)
.png)
滬公網(wǎng)安備31011502016746號(hào)